Electrolytic extraction methods of Al-Fe intermetallic compounds
نویسندگان
چکیده
منابع مشابه
Fabrication of Fe-Al Intermetallic Foams via Organic Compounds Assisted Sintering
The influence of the addition of organic compounds, such as palmitic acid and cholesteryl myristate, on the porous structure of Fe-Al intermetallics formation has been investigated in detail in this paper. It was found that additives have a significant effect on the final porosity of the obtained sinters. Formed gaseous products from combustion play the role of the foaming agent during Fe-Al in...
متن کاملTribological Behaviour of Fe-Al Intermetallic Compound Coated Carbon Tool Steel
The use of Fe-Al intermetallic compound coatings has been investigated in order to improve the tribological behaviour of carbon tool steel. The coatings were formed by a pack cementation process and subsequently diffusion annealing at 900˚C in an argon controlled atmosphere. The optimum diffusion time was selected on the basis of optimum thickness and tribological behaviour. The microstructure...
متن کاملTribological Behaviour of Fe-Al Intermetallic Compound Coated Carbon Tool Steel
The use of Fe-Al intermetallic compound coatings has been investigated in order to improve the tribological behaviour of carbon tool steel. The coatings were formed by a pack cementation process and subsequently diffusion annealing at 900˚C in an argon controlled atmosphere. The optimum diffusion time was selected on the basis of optimum thickness and tribological behaviour.
The microstructu...
متن کاملCorrosion Behavior of Detonation Gun Sprayed Fe-Al Type Intermetallic Coating
The detonation gun sprayed Fe-Al type coatings as an alternative for austenitic valve steel, were investigated using two different methods of testing corrosion resistance. High temperature, 10-hour isothermal oxidation experiments at 550, 750, 950 and 1100 °C show differences in the oxidation behavior of Fe-Al type coatings under air atmosphere. The oxide layer ensures satisfying oxidation resi...
متن کاملGrowth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
Copper wires are increasingly used in place of gold wires for making bonded interconnections in microelectronics. There are many potential benefits for use of copper in these applications, including better electrical and mechanical properties, and lower cost. Usually, wires are bonded to aluminum contact pads. However, the growth of Cu/Al intermetallic compounds (IMC) at the wire/pad interfaces...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Japan Institute of Light Metals
سال: 1973
ISSN: 0451-5994
DOI: 10.2464/jilm.23.487